HXB6060L Diamond wire slicer

Main function：

This equipment is mainly used to cut monocrystalline silicon, polysilicon, silicon carbide, ceramics, magnetic materials and other hard and brittle materials;

The maximum workpiece size available for cutting:600mmx600mmx600mm

Machine weight:＜1000kg

Main feature：

The equipment has high cutting precision and good stability;

Small sawing seam (suitable for 0.25~1mm diameter diamond wire), saving materials, convenient wire change;

Efficient cutting for cutting speed up to 3000m/min;

With cutting fluid circulation system, it can be used independently, and can also use the workshop centralized liquid supply system;

Optional turntable for automatic cutting in any direction;

Two degrees of freedom crystal orientation adjustment fixture is available.