WFXV5030 reciprocating sand line slicer

Main function：

This equipment is suitable for cutting hard and brittle materials such as gems, crystals, quartz, monocrystalline silicon, magnetic materials, etc;

The diamond wire in the cutting area is in a horizontal state and moves up and down to achieve the slicing function;

Maximum workpiece size available for cutting：500mmx500mmx300mm.

Main feature：

Using small wire diameter (diameter 0.1~0.45mm) diamond wire cutting, for sawing small seam and saving materials;

150m large storage capacity, suitable for long-term operation;

Optional turntable, can achieve a clamping,for cutting XY two directions. After the turntable is selected, the cutting height is reduced to 130mm;

Two degrees of freedom crystal orientation adjustment fixture is available.

Main parameter list：