DX2318 crystal, quartz, multi-wire sawing

Main function：

This equipment is mainly used to cut monocrystalline silicon, polysilicon, silicon carbide, ceramics, magnetic materials and other hard and brittle materials. Through high-precision cutting, improve work efficiency and reduce loss.

The maximum workpiece size that can be cut:230mmx250mmx180mm

Machine weight:7500kg

Main feature：

The main body of the machine is cast and forged, which has good stability;

International famous brand servo drive for high control precision and fast response;

Efficient cutting for cutting speed up to 2500m/min;

Humanized operation interface for intelligence and convenience;

The surface of the equipment is treated with imported paint, which does not lose paint or fade;

Feed table ±6 degrees swing design, suitable for superhard, brittle material processing.